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On May 28, BOCO Electronics’ Hengyang Intelligent Manufacturing Base was officially inaugurated and commenced operations.
As a flagship project representing the “Return of Hunan Entrepreneurs” initiative, the base is located in the Hengyang High-Tech Zone, covering an area of 20,000 square meters. It features a four-story vertical intelligent layout and is fully equipped with automated and digitalized production systems.
The new facility offers flexible manufacturing capacity for up to one million units of high-end power supply products annually, marking a critical step forward for BOCO Electronics in high-efficiency intelligent manufacturing. Once operational, the base will significantly enhance manufacturing delivery efficiency and customization capabilities, meeting diverse application requirements and providing global customers with high-frequency, high-efficiency, and high–power-density premium power solutions.
The commissioning ceremony brought together representatives from government, academia, enterprises, suppliers, and partners. Distinguished guests from Hengyang High-Tech Holding Group, Hunan University of Technology, Hunan University of Arts and Science, Hengyang Technician College, University of South China, China Telecom Hengyang Branch, Shenzhen Bitmain Technologies Co., Ltd., Shenzhen Hello Tech Energy Co., Ltd. (Huabao New Energy), Zhejiang Hengyang Chamber of Commerce, and Aihua Group Co., Ltd. jointly witnessed this milestone moment.
During the keynote speeches, Yin Guodong, Chairman and General Manager of BOCO Electronics, stated:
“The launch of the Hengyang manufacturing base is a pivotal step in BOCO Electronics’ strategy of ‘intelligent manufacturing + regional collaboration.’ By deeply integrating our power electronics expertise with Hengyang’s strong manufacturing foundation, advantageous location, and talent resources, we have established a three-location synergy model of ‘Hangzhou Headquarters + Hengyang Manufacturing + Shanghai R&D.’ This structure enables us to deliver faster and more reliable products and services to customers both domestically and globally.”
He further emphasized that BOCO Electronics will actively integrate into local development, promote local employment, and contribute to Hengyang’s vision of becoming a strong intelligent manufacturing city.
Yang Zuoxing, Chairman of Shenzhen Bitmain Technologies Co., Ltd., commented:
“BOCO Electronics has achieved remarkable technological breakthroughs in computing power supplies, with product efficiency reaching 97.5%. This provides solid support for data center operations and injects strong momentum into the green energy transition. We look forward to deepening technical synergy and industrial cooperation in the future.”
Liu Jianhua, Dean of the School of Transportation and Electrical Engineering at Hunan University of Technology, noted:
“Our industry–academia–research collaboration with BOCO Electronics will strongly promote the integrated development of technology innovation and talent cultivation, helping advance the power electronics field to a new level.”
At the ceremony, BOCO Electronics signed cooperation agreements with China Telecom Hengyang Branch, Hunan University of Technology, and Hunan University of Arts and Science. These partnerships will focus on intelligent manufacturing, 5G smart factory development, and industry–education integration.
The collaboration with China Telecom Hengyang Branch will center on 5G communication, digital transformation, and intelligent manufacturing, accelerating the deployment of smart factory solutions. Partnerships with universities will emphasize joint talent development, co-designed curricula, and collaborative research, facilitating the commercialization of research and building a high-quality, sustainable platform for talent practice and research incubation.
The world is rapidly entering an era where artificial intelligence and green energy develop in parallel. According to McKinsey, global AI data center electricity demand is expected to reach 1,000–1,500 TWh annually by 2030, placing enormous pressure on energy infrastructure. At the same time, energy storage systems are becoming a critical component of next-generation power systems.
BOCO Electronics has proactively adopted a dual-engine strategy of “computing power supplies + energy storage power supplies,” continuing to deepen its expertise in high-efficiency energy conversion technologies. Its products are widely applied in intelligent computing centers, data centers, new energy transportation, communications, healthcare, and other strategic sectors. Leveraging high reliability, fast system response, and the combination of front-end collaboration with flexible production lines, BOCO Electronics further strengthens its customized service capabilities to meet the personalized needs of diverse application scenarios.
The official commissioning of the Hengyang base represents a major milestone in BOCO Electronics’ “intelligent manufacturing + regional collaboration” strategy. Looking ahead, the company will use Hengyang as its core manufacturing hub to build an integrated “R&D–manufacturing–response” system, continuously delivering efficient, green, and secure energy conversion solutions to global customers and driving the energy industry toward a more intelligent and low-carbon future.
